Jenn-Ming Song,: search on Z-Library

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1

Oxidation characteristics of commercial copper-based lead frame surface and the bonding with epoxy molding compounds

Chao, Shih-Chieh, Huang, Wei-Chen, Liu, Jen-Hsiang, Song, Jenn-Ming, Shen, Po-Yen, Huang, Chi-Lin, Hung, Lung-Tang, Chang, Chin-Huang

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 2.92 MB

english, 2019

2

Electrochemical Corrosion Properties of Commercial Ultra-Thin Copper Foils

Yen, Ming-Hsuan, Liu, Jen-Hsiang, Song, Jenn-Ming, Lin, Shih-Ching

Journal:

Journal of Electronic Materials

Year:

2017

Language:

english

File:

PDF, 2.68 MB

english, 2017

3

Recent progress in electronic interconnection

Nishikawa, Hiroshi, Song, Jenn-Ming, Chen, Chih-Ming

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 259 KB

english, 2019

4

Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints

Jenn-Ming Song, Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 2.67 MB

english, 2012

5

Power electronics packaging

Suganuma, Katsuaki, Song, Jenn-Ming, Lai, Yi-Shao

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 130 KB

english, 2015

6

Alloying modification of Sn–Ag–Cu solders by manganese and titanium

Li-Wei Lin, Jenn-Ming Song, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee, Jun-Yen Uan

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 637 KB

english, 2009

7

One-step synthesis of uniform silver nanoparticles capped by saturated decanoate: direct spray printing ink to form metallic silver films

Dong, Teng-Yuan, Chen, Wei-Ting, Wang, Ching-Wen, Chen, Chiao-Pei, Chen, Chen-Ni, Lin, Ming-Cheng, Song, Jenn-Ming, Chen, In-Gann, Kao, Tzu-Hsuan

Journal:

Physical Chemistry Chemical Physics

Year:

2009

Language:

english

File:

PDF, 1.61 MB

english, 2009

8

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Effect of minor alloying additions on the BIT reliability of SnAgCu solder joints

Yao-Ren Liu,, Jenn-Ming Song,, Yi-Shao Lai,, Ying-Ta Chiu,

Year:

2009

Language:

english

File:

PDF, 1.35 MB

english, 2009

9

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Phase transformations of alloyed and core-shell metallic nanoparticles for interconnect applications

Song, Jenn-Ming

Year:

2014

Language:

english

File:

PDF, 1.16 MB

english, 2014

10

[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Low temperature interconnect fabrication on PDMS polymeric substrates using Ag nanoparticles and submicron particles

Sin-Yong Liang,, Yu-Siang Fang,, Po-Hao Chiang,, Jenn-Ming Song,, Lung-Tai Chen,

Year:

2016

Language:

english

File:

PDF, 758 KB

english, 2016

11

Light enhanced direct Cu bonding for advanced electronic assembly

Liang, Sin-Yong, Song, Jenn-Ming, Huang, Shang-Kun, Chiu, Ying-Ta, Tarng, David, Hung, Chih-Pin

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2018

Language:

english

File:

PDF, 3.44 MB

english, 2018

12

[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Influence of Grain Refinement on Direct Bonding for Electrodeposited Copper

Xie, Zong-Yu, Yu, I-You, Song, Jenn-Ming, Tarng, David, Hung, Chih-Pin

Year:

2019

Language:

english

File:

PDF, 2.24 MB

english, 2019

13

[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Low temperature direct Cu bonding assisted by residual stress

Liang, Sin-Yong, Chiang, Po-Hao, Xie, Zong-Yu, Song, Jenn-Ming, Huang, Shang-Kun, Chiu, Ying-Ta, Tarng, David, Hung, Chih-Pin

Year:

2017

Language:

english

File:

PDF, 619 KB

english, 2017

14

Low temperature de-oxidation for copper surface by catalyzed formic acid vapor

Chou, Pei-Wen, Song, Jenn-Ming, Xie, Zong-Yu, Akaike, Masatake, Suga, Tadatomo, Fujino, Masahisa, Lin, Jing-Yuan

Journal:

Applied Surface Science

Year:

2018

Language:

english

File:

PDF, 3.77 MB

english, 2018

15

[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Light Enhanced Cu to Cu Bonding with Different Electromagnetic Radiations

Chiu, Yung-Da, Tarng, David, Hung, Chih-Pin, Liang, Sin-Yong, Song, Jenn-Ming

Year:

2019

Language:

english

File:

PDF, 196 KB

english, 2019

16

[IEEE 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2012.12.10-2012.12.12)] 2012 2nd IEEE CPMT Symposium Japan - Phase transformation of Cu@Ag core-shell nanoparticles upon heating

Tsai, Chi-Hang, Chen, Shih-Yun, Song, Jenn-Ming, Chen, In-Gann, Lee, Hsin-Yi

Year:

2012

Language:

english

File:

PDF, 1.38 MB

english, 2012

17

[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Real time FITR spectroscopic and kinetic studies of Cu surface reduction by using formic acid vapor

Kuo, Chia-Chen, Song, Jenn-Ming

Year:

2014

Language:

english

File:

PDF, 345 KB

english, 2014

18

[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Influence of pretreatment on copper direct bonding

Chiang, Po-Hao, Song, Jenn-Ming

Year:

2016

Language:

english

File:

PDF, 806 KB

english, 2016

19

Orientation dependence of the electrochemical corrosion properties of electrodeposited Cu foils

Song, Jenn-Ming, Zou, Yong-Sheng, Kuo, Chia-Chen, Lin, Shi-Ching

Journal:

Corrosion Science

Year:

2013

Language:

english

File:

PDF, 3.33 MB

english, 2013

20

[IEEE 2010 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Tokyo, Japan (2010.08.24-2010.08.26)] 2010 IEEE CPMT Symposium Japan - Phase transformation of metallic nanoparticle deposits for the electrodes of flexible electronics

Kao, Tzu-Hsuan, Song, Jenn-Ming, Wang, Jian-Yih, Chen, In-Gann

Year:

2010

Language:

english

File:

PDF, 465 KB

english, 2010

21

Texture and temperature dependence on the mechanical characteristics of copper electrodeposits

Jenn-Ming Song, Ding-Siang Wang, Chung-Hsien Yeh, Wei-Chih Lu, Yung-Sheng Tsou, Shi-Ching Lin

Journal:

Materials Science and Engineering: A

Year:

2013

Language:

english

File:

PDF, 2.24 MB

english, 2013

22

[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Effects of electromagnetic radiation exposure on direct Cu bonding

Song, Jenn-Ming, Liang, Sin-Yong, Chiang, Po-Hao, Huang, Shang-Kun, Chiu, Ying-Ta, Tarng, David, Hung, Chih-Pin

Year:

2017

Language:

english

File:

PDF, 566 KB

english, 2017

23

Ball Impact Reliability of Zn-Sn High-Temperature Solder Joints Bonded with Different Substrates

Jenn-Ming Song, Meng-Ju Lin, Kun-Hung Hsieh…

Journal:

Journal of Electronic Materials

Year:

2013

Language:

english

File:

PDF, 977 KB

english, 2013

24

[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Low-temperature low-pressure bonding by nanocomposites

Wu, Ting-Jui, Liu, Jen-Hsiang, Song, Jenn-Ming

Year:

2017

File:

PDF, 852 KB

2017

25

Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints

Song, Jenn-Ming, Huang, Bo-Chang, Tarng, David, Hung, Chih-Pin, Yasuda, Kiyokazu

Journal:

Year:

2020

File:

PDF, 4.52 MB

2020

26

[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Microstructural Effects on Electrodeposited Copper Direct Bonding

Song, Jenn-Ming, Xie, Zong-Yu, Xie, Zong-Yu, Hung, Chih-Pin

Year:

2019

File:

PDF, 186 KB

2019

27

[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Direct bonding for dissimilar metals assisted by carboxylic acid vapor

Huang, Shang-Kun, Fan, Chih-Hao, Kuo, Chia Chen, Song, Jenn-Ming

Year:

2014

Language:

english

File:

PDF, 600 KB

english, 2014

28

Guest Editorial – Low Temperature Processing for Microelectronics and Microsystems Packaging

Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 111 KB

english, 2012

29

Enhanced Cu-to-Cu direct bonding by controlling surface physical properties

Chiang, Po-Hao, Liang, Sin-Yong, Song, Jenn-Ming, Huang, Shang-Kun, Chiu, Ying-Ta, Hung, Chih-Pin

Journal:

Japanese Journal of Applied Physics

Year:

2017

Language:

english

File:

PDF, 659 KB

english, 2017

30

Microstructural Characteristics and Vibration Fracture Properties of Al-Mg-Si Alloys with Excess Cu and Ni

Song, Jenn-Ming, Lin, Tsen-Yi, Chuang, Hsin-Yi

Journal:

MATERIALS TRANSACTIONS

Year:

2007

Language:

english

File:

PDF, 359 KB

english, 2007

31

Substrate Dissolution and Shear Properties of the Joints between Bi-Ag Alloys and Cu Substrates for High-Temperature Soldering Applications

Jenn-Ming Song, Hsin-Yi Chuang, Zong-Mou Wu

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 728 KB

english, 2007

32

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Failure mode evolution of WLCSP on board by dynamic bend method

Chi-Ko Yu,, Graver Chang,, Tina Shao,, Cherie Chen,, Jeffrey Lee,, Jenn-Ming Song,, Yao-Ren Liu,, Mon-Chin Tsai,

Year:

2009

Language:

english

File:

PDF, 1.25 MB

english, 2009

33

Nanomechanical Responses of an Intermetallic Compound Layer in Transient Liquid Phase Bonding Using Indium

Song, Jenn-Ming, Lu, Wei-Chih, Chou, Pei-Wen

Journal:

Journal of Electronic Materials

Year:

2019

Language:

english

File:

PDF, 2.42 MB

english, 2019

34

[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Interconnect Fabrication using Copper Oxide Particles by Photonic-sintering

Chiu, Po-Hsiang, Song, Jenn-Ming

Year:

2019

File:

PDF, 2.59 MB

2019

35

Nanosized induced low-temperature alloying in binary and ternary noble alloy systems for micro-interconnect applications

Tzu-Hsuan Kao, Jenn-Ming Song, In-Gann Chen, Teng-Yuan Dong, Weng-Sing Hwang

Journal:

Acta Materialia

Year:

2011

Language:

english

File:

PDF, 1.13 MB

english, 2011

36

Oxidation of liquid solders for die attachment

Jenn-Ming Song, Yun-Min Cheng, Chi-Hang Tsai

Journal:

Corrosion Science

Year:

2010

Language:

english

File:

PDF, 770 KB

english, 2010

37

Effect of Ni fillers on microwave absorption and effective permeability of NiCuZn ferrite/Ni/polymer functional composites

Shi-Yuan Tong, Mean-Jue Tung, Wen-Song Ko, Yu-Ting Huang, Yen-Ping Wang, Li-Chun Wang, Jenn-Ming Wu

Journal:

Journal of Alloys and Compounds

Year:

2013

Language:

english

File:

PDF, 776 KB

english, 2013

38

[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Effect of transition metals on the interfacial reactions in electroless Ni(P)-solder interconnections

Liu, Yao-Ren, Song, Jenn-Ming, Lai, Yi-Shao, Chiu, Ying-Ta, Chen, Wei-Ting

Year:

2008

Language:

english

File:

PDF, 2.60 MB

english, 2008

39

[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Heat resistant Bi-Ag-X solders for power IC die attachment

Song, Jenn-Ming, Chang, Zhang-Hong

Year:

2015

Language:

english

File:

PDF, 2.01 MB

english, 2015

40

Crystallization, morphology and distribution of Ag3Sn in Sn–Ag–Cu alloys and their influence on the vibration fracture properties

Jenn-Ming Song, Jian-Jhih Lin, Chi-Feng Huang, Hsin-Yi Chuang

Journal:

Materials Science and Engineering: A

Year:

2007

Language:

english

File:

PDF, 2.37 MB

english, 2007

41

Mechanical Responses of Superlightβ-Based Mg-Li-Al-Zn Wrought Alloys under Resonance

Jenn-Ming Song, Yi-Hua Lin, Chien-Wei Su, Jian-Yih Wang

Journal:

Metallurgical and Materials Transactions A

Year:

2009

Language:

english

File:

PDF, 559 KB

english, 2009

42

Kinetic study of Pt nanocrystal deposition on Ag nanowires with clean surfaces via galvanic replacement

Yu-Lin Shen, Shih-Yun Chen, Jenn-Ming Song, In-Gann Chen

Journal:

Nanoscale Research Letters

Year:

2012

Language:

english

File:

PDF, 586 KB

english, 2012

43

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Ball impact responses of Sn-Ag-Cu solder joints doped with Ni or Ge

Yi-Shao Lai,, Hsiao-Chuan Chang,, Ying-Ta Chiu,, Chang-Lin Yeh,, Jenn-Ming Song,

Year:

2007

Language:

english

File:

PDF, 953 KB

english, 2007

44

Effects of Matrix Structure on the Resonant Vibration Behavior of Spheroidal Graphite Cast Iron

Song, Jenn-Ming, Lin, Shi-Ching, Lui, Truan-Sheng, Chen, Li-Hui, Song, Yu-Hua

Journal:

MATERIALS TRANSACTIONS

Year:

2004

Language:

english

File:

PDF, 314 KB

english, 2004

45

Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid

Li, Wen-Hua, Lin, Pei-Syuan, Chen, Chen-Ni, Dong, Teng-Yuan, Tsai, Chi-Hang, Kung, Wan-Ting, Song, Jenn-Ming, Chiu, Ying-Ta, Yang, Ping-Feng

Journal:

Materials Science and Engineering: A

Year:

2014

Language:

english

File:

PDF, 2.09 MB

english, 2014

46

An in situ study on the coalescence of monolayer-protected Au-Ag nanoparticle deposits upon heating

Song, Jenn-Ming, Chen, Wei-Ting, Hsieh, Kun-Hung, Kao, Tzu-Hsuan, Chen, In-Gann, Chiu, Shang-Jui, Lee, Hsin-Yi

Journal:

Nanoscale Research Letters

Year:

2014

Language:

english

File:

PDF, 2.30 MB

english, 2014

47

Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates

Song, Jenn-Ming, Shen, Yu-Lin, Su, Chien-Wei, Lai, Yi-Shao, Chiu, Ying-Ta

Journal:

MATERIALS TRANSACTIONS

Year:

2009

Language:

english

File:

PDF, 178 KB

english, 2009

48

A Study on Electro-Discharge Machined Surfaces of Ferritic SG Cast Irons

Tsai, De-Chang, Song, Jenn-Ming, Lui, Truan-Sheng, Chen, Li-Hui

Journal:

MATERIALS TRANSACTIONS

Year:

2002

Language:

english

File:

PDF, 406 KB

english, 2002

49

[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Surface Analyses of Oxidized Cu-Fe-Zn-P Lead Frames

Chao, Shih-Chieh, Liu, Jen-Hsiang, Huang, Wei-Chen, Song, Jenn-Ming, Shen, Po-Yen, Huang, Chi-Lin, Hung, Lung-Tang, Chang, Chin-Huang

Year:

2019

File:

PDF, 1.88 MB

2019

50

Dissolution behavior of Cu and Ag substrates in molten solders

Po-Yi Yeh, Jenn-Ming Song, Kwang-Lung Lin

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 1.05 MB

english, 2006

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